rus
Issue #6/2020
D. Vertyanov, S. Evstafiev, P. Viklund, V. Sidorenko
Unpackaged element’s internal mounting technologies and design aspects for microsystems with embedded chips. Part 1
Unpackaged element’s internal mounting technologies and design aspects for microsystems with embedded chips. Part 1
DOI: 10.22184/1992-4178.2020.197.6.96.102
The article provides an overview of technologies and design and technological solutions for internal mounting the elements in package and PCB substrate structure, discusses the problems and ways of solving them when implementing a project with embedded active and passive components using Mentor, A Siemens Business CAD system.
The article provides an overview of technologies and design and technological solutions for internal mounting the elements in package and PCB substrate structure, discusses the problems and ways of solving them when implementing a project with embedded active and passive components using Mentor, A Siemens Business CAD system.
Теги: adhesive chip first technology chip last technology embedded component internal mounting technology laminate laser processing metal foil prepreg substrate unpackaged element адгезив бескорпусной элемент встроенный компонент лазерная обработка ламинат металлическая фольга подложка препрег технология chip first технология chip last технология внутреннего монтажа
Unpackaged element’s internal mounting technologies and design aspects for microsystems with embedded chips. Part 1
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